Ion implantation system for implanting workpieces

ABSTRACT

An ion implantation system that rapidly and efficiently processes large quantities of workpieces, such as flat panel displays. The ion implantation system includes a high vacuum process chamber that mounts an ion source, a single workpiece translating stage, and a loadlock. The single workpiece handling assembly mounted within the process chamber both removes the workpiece from the loadlock and supports the workpiece during implantation by the ion beam generated by the ion source. The process chamber is in selective fluid communication with a loadlock assembly, which in turn is mechanically integrated with a workpiece loading or end station. Additionally, the workpiece handling assembly includes a translation stage or element for translating the workpiece in a linear scanning direction during implantation. This linear scanning direction extends along a path transverse or orthogonal to the horizontal longitudinal axis of the implantation system. According to one practice, the scanning direction and the longitudinal axis form an angle therebetween that is less than or equal to about 85 degrees.

REFERENCE TO RELATED APPLICATIONS

This application is a continuation application of Ser. No. 08/756,133,now U.S. Pat. No. 5,793,050 which is a continuation-in-part applicationof Ser. No. 08/601,983 (now abandoned), filed Feb. 16, 1996, entitled"Ion Implantation System For Flat Panel Displays", and is related to thecommonly assigned application Ser. No. 08/756,972 (now U.S. Pat. No.5,828,070), filed herewith, entitled "System And Method For CoolingWorkpieces Processed By An Ion Implantation System"; application Ser.No. 08/757,726 (now U.S. Pat. No. 5,811,823), filed herewith, entitled"Control Mechanisms For Dosimetry Control In Ion Implantation Systems";application Ser. No. 08/756,656 (now U.S. Pat. No. 5,825,038), filedherewith, entitled "Large Area Uniform Ion beam Formation"; andapplication Ser. No. 08/756,372 (now abandoned), filed herewith entitled"Loadlock Assembly For An Ion Implantation System". The teachings of allthe foregoing applications are incorporated herein by reference.

BACKGROUND OF THE INVENTION

The present invention relates to processing systems for processingworkpieces, and more particularly, to high throughput ion implantationsystems and methods for implanting workpieces.

Ion implantation has become a standard, commercially accepted techniquefor introducing conductivity-altering dopants into a workpiece, such asa semiconductor wafer or thin film deposition on a glass substrate, in acontrolled and rapid manner. Conventional ion implantation systemsinclude an ion source that ionizes a desired dopant element which isthen accelerated to form an ion beam of prescribed energy. This beam isdirected at the surface of the workpiece. Typically, the energetic ionsof the ion beam penetrate into the bulk of the workpiece and areembedded into the crystalline lattice of the material to form a regionof desired conductivity. This ion implantation process is typicallyperformed in a high vacuum, gas-tight process chamber which encases aworkpiece handling assembly, a workpiece support assembly, and the ionsource. This high vacuum environment prevents dispersion of the ion beamby collisions with gas molecules and also minimizes the risk ofcontamination of the workpiece by airborne particulates.

The process chamber is typically coupled via a valve assembly with aprocessing end station. The end station can include an intermediateloadlock chamber or pressure lock which can be pumped down fromatmospheric pressure by a vacuum pumping system. The chamber isselectively closed at a downstream end by the valve assembly, whichselectively places the loadlock chamber in fluid communication with theprocess chamber. The loadlock chamber is also coupled at an opposite endto an upstream valve assembly. The end station also includes an endeffector which transfers workpieces from one or more workpiececassettes, through the upstream valve assembly, and into the chamber.Once a workpiece has been loaded into the intermediate chamber by theend effector, the chamber is evacuated via the pumping system to a highvacuum condition compatible with the process chamber. The valve assemblyat the downstream end of the intermediate chamber then opens and theworkpiece handling assembly mounted within the process chamber removesthe workpiece from the intermediate chamber and transfers the workpieceto the support assembly, which supports the workpiece during processing.For example, a loading arm of the workpiece handling assembly removesthe workpiece from the intermediate chamber and places it on a platen ofthe workpiece support structure. The workpiece support then moves theworkpiece in the scanning direction past the operating ion source, whichimplants the workpiece.

A conventional workpiece support structure includes a rotating disc thatmounts a plurality of workpieces, or includes a structure for moving theworkpiece in a horizontal scanning direction. The multiple movements ofthe components of the ion implantation system consume valuableprocessing time, thus reducing the throughput of the system.

Today's burgeoning semiconductor and implantation technology has foundwidespread acceptance in the marketplace. With this acceptance has comedemands for generating large quantities of implanted workpieces atcompetitive prices. A common goal of most modern implantation systems isto satisfy these demands by increasing the throughput of the system.Presently existing systems, however, are not well suited to meet thesemanufacturing and cost demands.

Another major problem of present commercial ion implantation systemsconcerns the costs of operating the facility. Conventional ionimplantation systems require relatively large dedicated space and thushave a high associated cost per square foot. Consequently, traditionalimplantation systems have been relatively expensive to operate.

Hence, there exists a need in the art for improved ion implantationsystems and methods that exhibit high throughput, require less floorspace, and are more cost efficient to operate. In particular, ionimplantation systems that can rapidly process high volumes of workpieceswould represent a major improvement in the art.

SUMMARY OF THE INVENTION

The present invention provides a high throughput ion implantation systemthat employs a single workpiece handling assembly to handle and toprocess in a rapid and efficient manner large quantities of workpieces,such as flat panel displays. The ion implantation system of the presentinvention is designed to process flat panels of various sizes, includingpanels having dimensions of 550 mm by 650 mm and larger.

The ion implantation system can include a process housing defining ahigh vacuum process chamber that mounts an ion source and a singleworkpiece handling assembly. The workpiece handling assembly removes theworkpiece from a loadlock chamber and supports the workpiece duringimplantation by the ion beam generated by the ion source. The processchamber is in selective fluid communication with the loadlock chamber,which in turn is mechanically integrated with a workpiece loading or endstation.

According to one aspect of the invention, the workpiece handlingassembly can include a translation stage or element for translating theworkpiece in a linear manner during implantation. This lineartranslation direction can be a horizontal translation direction, or itcan be tilted, e.g., transverse or orthogonal, relative to thehorizontal axis of the implantation system. According to one practice,translation of the workpiece is conducted along a planar path that istilted at an angle relative to the horizontal axis that is less than orequal to about 85 degrees.

According to another aspect, the ion beam generated by the ion sourceextends in a direction transverse to the longitudinal axis, andaccording to one embodiment, is generally parallel to the transversetranslation direction. The translation stage moves the workpiece throughthe ion beam in the scanning direction.

According to another aspect, the workpiece handling assembly includes aplaten for supporting the workpiece during processing, and structure formoving the position of the platen relative to the loadlock chamber.

In another aspect, the system further includes a pump assembly, e.g., apressure regulator, that is coupled to the loadlock chamber fordisposing the loadlock chamber at a selected pressure. In still anotherapsect, the system includes a temperature control element coupled to theloadlock for disposing at least a portion of the loadlock or workpieceat a selected temperature.

According to another aspect, the system includes cooling structure fordisposing the floor of the loadlock chamber at a selected temperature toform a cold deck. A vacuum network can also be coupled to the chamberfloor for drawing the workpiece into contact therewith when theworkpiece is disposed within the chamber, thereby effecting heattransfer from the workpiece to the chamber floor. The vacuum network cancomprise a duct network (e.g., a plurality of transverse fluid grooves)formed within the chamber floor and in fluid communication with a vacuumsource for disposing a substantial portion of the backside of theworkpiece in contact with the cooling surface.

According to still another aspect, the ion implantation system includesstructure, such as a fluid conduit in communication with a fluid source,for circulating a cooling fluid through the chamber floor to form acooling surface.

According to still another aspect, the loadlock assembly includes aplurality of loadlock elements that are axially positioned relative toeach other to form a stacked array of loadlocks. This stacked array ofloadlock elements forms an axial stack of loadlock chambers.Furthermore, each loadlock of the array nests with an adjacent loadlockwhen stacked together. According to one practice, a bottom surface ofone of the loadlocks has a first geometric shape and a top surface of anadjacent loadlock has a complementary geometric shape such that theloadlocks nest together when stacked. According to one practice, thebottom surface of each loadlock has a first bottom-most side, anoutwardly stepped second bottom side, and a further outwardly steppedthird bottom side. The top surface of each loadlock has a first topmostface, a recessed second face which is separated from the first face by afirst wall portion, and a further recessed third top face. This stackedarray of loadlocks facilitates processing of multiple workpieces by theion implantation system.

The ion implantation system further provides an ion source thatgenerates an ion beam, and is coupled to a housing defining a processchamber. The process chamber is coupled to a loadlock chamber. Aworkpiece handling assembly is mounted within the process chamber forsupporting the workpiece during implantation by the ion beam generatedby the ion source, such that the handling assembly translates theworkpiece in a linear scanning direction transverse to the horizontallongitudinal axis of the implantation system during processing.

According to one aspect, the plane of the workpiece is tilted at anangle relative to the system's horizontal plane equal to or less thanabout 85 degrees. Additionally, the ion beam generated by the ion sourceis directed transverse to the longitudinal axis to form an angletherebetween greater than or equal to about 5 degrees. Thus, theworkpiece is translated in a nearly vertical orientation, and the ionsource is likewise mounted at an angle to ensure substantiallyorthogonal bombardment of the workpiece with ions.

The invention will next be described in connection with certainpreferred embodiments. However, it should be clear that various changesand modifications can be made by those skilled in the art withoutdeparting from the spirit and scope of the invention.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing and other objects, features and advantages of theinvention will be apparent from the following description and apparentfrom the accompanying drawings, in which like reference characters referto the same parts throughout the different views. The drawingsillustrate principles of the invention and, although not to scale, showrelative dimensions.

FIG. 1A is a perspective view of one embodiment of the ion implantationsystem according to the present invention;

FIG. 1B is a top view of a portion of the ion implantation system ofFIG. 1A;

FIG. 2 is a perspective view of an alternate embodiment of the ionimplantation system of the present invention;

FIGS. 3A-3B are an exploded perspective view of the loadlock assembly ofthe present invention;

FIGS. 4A-4B are an exploded view of each constituent loadlock of theloadlock assembly of FIGS. 3A-3B;

FIG. 4C is a cross-sectional view of a pair of nested loadlocks of theloadlock assembly of FIGS. 3A-3B;

FIG. 5 is a cross-sectional view of the loadlock and process chamber ofFIG. 1A illustrating the sliding seal arrangement of the presentinvention;

FIG. 6 is a cross-sectional view of an alternate embodiment of thesliding seal arrangement of the present invention;

FIG. 7 shows a perspective view of the loadlock assembly of FIG. 1 in aserial configuration;

FIG. 8 illustrates a detailed view in perspective of the pick up arm ofthe workpiece handling assembly of FIG. 1;

FIG. 9 schematically illustrates that multiple processes can beperformed upon a single panel concurrently;

FIG. 10 is a top view of another embodiment of the ion implantationsystem according to the teachings of the present invention;

FIG. 11 is a side perspective view of the ion implantation system ofFIG. 10;

FIG. 12 is a schematic cross-sectional view of the process housing andchamber of the ion implantation system of FIG. 10 illustrating the panelhandling assembly of the present invention;

FIG. 13 is an exemplary perspective view, partly broken away, of theprocess chamber and housing of the ion implantation system of FIGS.10-12 illustrating the panel movement while processing multiple panelsaccording to the teachings of the present invention; and

FIG. 14 is a schematic timing diagram illustrating the particular eventswhich the ion implantation system of FIG. 10 undergoes when processingmultiple panels in the stacked loadlock array of FIGS. 3A-4C.

DESCRIPTION OF ILLUSTRATED EMBODIMENTS

With reference to FIGS. 1A and 1B, the ion implantation system 10 of thepresent invention includes a pair of panel cassettes 26, an end effector24, an assembly of loadlock chambers 12, a housing 14 which defines aprocess chamber 16, and an ion source 18, which communicates with theprocess chamber 16 through beam aperture 20. An end effector 24transfers workpieces, such as flat panels P, stacked in cassette 26 tothe loadlock assembly 12.

The illustrated end effector 24 is coupled to a conventional drive andcontrol mechanism which provides power to the end effector and whichcontrols the rate and sequence of panel movement. The panel cassettes 26are of conventional design and provide a convenient storage facility forthe panels.

The loadlock assembly 12 is also coupled to a linear bearing system anda linear drive system, which provide the desired vertical movement ofthe loadlock assembly 12 as well as place and hold the loadlock assembly12 in sealing contact with the process chamber housing 14, as describedin further detail below. The linear drive system includes a lead screw22 and a motor assembly 23. The motor assembly 23 drives the lead screw22 which in turn positions the loadlock assembly 12 at a selectedvertical position, as indicated in dashed lines. The linear bearingsystem includes a pair of stationary linear bearings 28 mounted to theloadlock assembly which slide along circular shafts 29.

A translation or workpiece holding assembly is preferably mounted withinthe process chamber 16. The translation assembly includes a pickup arm27 which is similar in function to the end effector 24. The pickup arm27 handles the panel P during processing. When the pickup arm 27initially removes the panel P from the loadlock assembly 12, it isoriented in a substantially horizontal position P1. The pickup arm thenvertically flips the panel, as denoted by arrow 13, into a substantiallyvertical position P2. The translation assembly then moves the panel in ascanning or translation direction, from left to right in the illustratedembodiment, across the path of an ion beam emerging from aperture 20,and which is generated by the ion source 18.

According to another embodiment, the pickup arm 27 can tilt the panel Prelative to its original horizontal position prior to translating thepanel. In this embodiment, the ion source 18 is positioned on theprocess housing 14 to ensure substantially orthogonal bombardment of theworkpiece with ions.

With further reference to FIGS. 1A and 1B, the process chamber housing14 includes a front housing portion 14A and a narrower elongated portion14B. The front housing portion is sized to accommodate the removal ofthe panel P from the loadlock assembly 12 in the horizontal position.The panel is then moved from the original horizontal position P1 to thevertical position P2 prior to movement along the scanning direction,indicated in FIG. 1B by arrow 32. The housing portion 14B has an axialdimension along the scanning direction that allows the panel to passcompletely by the ribbon beam generated by the ion source 18. Therelatively narrow width of the chamber portion 14B preferably allows thepanel to move therealong only when disposed in the vertical position P2to reduce the total volume of the process chamber 16. This reduction inchamber volume allows faster evacuation of the process chamber. Reducingthe time necessary to evacuate the chamber serves to increase the totalthroughput of the implantation system 10.

The illustrated loadlock assembly 12 is preferably sealingly coupled tothe front chamber wall 34 of the chamber housing 14. The loadlockassembly 12 maintains a relatively pressure-tight and fluid-tight sealwith the chamber wall 34 during the vertical movement of the loadlockassembly 12. This sliding seal-tight arrangement is described in furtherdetail below.

Referring again to FIG. 1A, the ion source 18 in conjunction with theaperture 20 forms a ribbon beam which has dimensions smaller than thedimensions of the panel to be processed. More specifically, the ionsource 18 generates a ribbon beam 19 whose width (e.g., axial height)just exceeds the narrow panel dimension and whose length issubstantially smaller than the total length of the panel, e.g., thelarger panel dimension, FIG. 13. The use of a ribbon beam in conjunctionwith the ion implantation system 10 of the present invention providesfor several advantages, including (1) the ability to process panel sizesof different dimensions with the same system; (2) achieving a uniformimplant which can be controlled by varying the scan velocity of thepanel and by sampling the current of that portion of the ion beam thatextends beyond the narrow panel dimension; (3) the size of the ionsource can be reduced and is thus less expensive and easier to service;and (4) the ion source can be continuously operated. The continuousoperation of the ion source increases the efficiency of the ionimplantation system 10 since it produces a more uniform implant byeliminating problems associated with repeatedly turning the ion sourceoff and on, as in prior approaches. These problems typically includebeam current density transients which occur upon start-up operation ofthe source.

FIG. 2 is a schematic depiction of an alternate embodiment of the ionimplantation system 30 according to the present invention. Theillustrated system includes a loadlock assembly 42 which communicateswith a separate service chamber 46 and with the process chamber 40. Anion source 38 is in fluid communication with the process chamber 40, andwith a gas box 36 and associated control electronics 44, as is known inthe art. The illustrated ion source and gas box assembly are coupled toa power system that includes an isolation transformer 48 and a voltagestack 50. The process chamber 40 can be evacuated by known pumpingtechniques, such as by the vacuum assembly 52. Any particular exhaustgenerated during the implantation procedure can be exhausted from theouter housing 56 through exhaust ports 58.

The illustrated loadlock assembly 42 is intended to encompass anysuitable loadlock assembly that maximizes throughput by continuouslycycling panels through the process chamber 40. For example, the loadlockassembly 42 can include the stacked loadlock assembly of FIGS. 3A-6 orthe dual serial loadlock assembly of FIG. 8. Additionally, theillustrated system 30 further shows that the flat panel can be implantedfrom above while maintained in a substantially horizontal position whentranslated in the linear scanning direction.

FIGS. 3A through 5 illustrate a first embodiment of the loadlockassembly 60 of the present invention. The illustrated loadlock assembly60 includes a set of individual loadlock elements designated asloadlocks 62, 64, 66, 68 and 70. The loadlocks are preferably stackableand, according to a preferred practice, nestable to form a multi-chamberloadlock assembly 60 that provides for rapid cycling of panels to form ahigh throughput ion implantation system. The illustrated stacked set ofloadlocks extend along axis 93. The set of loadlocks can also be securedto a front flange 72. The front flange 72 functions as an interfacebetween the multi-chamber loadlock assembly 60 and the interface of theprocess chamber, e.g., wall 34 of housing 14. Those of ordinary skillwill recognize that the loadlock assembly can be directly coupled to theprocess chamber without utilizing an intermediate flange member, such asfront flange 72.

With reference to FIGS. 4A through 4C, each loadlock element of theloadlock assembly 60 has a selected configuration that facilitatesstacking and nesting of the loadlocks. For example, loadlock 62, whichis representative of any of loadlocks 62-70, includes a stepped topsurface 74 and a stepped bottom surface 76. The stepped top surface 74preferably includes a first outermost top surface 74A and an inwardlystepped or recessed surface 74B separated therefrom by a verticallyextending wall 74D. The loadlock surfaces preferably extend, in a firstorientation, along a horizontal axis 91, and the wall portion extendsalong axis 93. The top surface includes a further inwardly steppedsurface 74C which forms the floor of the loadlock chamber. The surface74C is separated from the stepped surface 74B by a second wall portion74E, parallel to wall portion 74D, and which forms a sidewall of theloadlock chamber.

Similarly, the stepped bottom portion 76 of the illustrated loadlock 62includes a vertically bottom-most surface 76C and an outwardly steppedsurface 76A, each surface being separated by a wall portion 76D whichextends along axis 93. The bottom surface 76 includes a furtheroutwardly stepped surface 76B, which is separated from the adjacentstepped surface 76A by a wall portion 76E. The wall portions 76E and 76Dare preferably substantially parallel to each other. The bottom-mostsurface 76C of the loadlock bottom surface forms the roof of theadjacent loadlock chamber, e.g., loadlock chamber 64, in the stackedarray.

The illustrated loadlock 62 further includes a pair of parallelsidewalls 78A and 78B, which are spaced apart along axis 91. Thesidewalls 78A and 78B, as well as the stepped top and bottom surfaces74, 76, terminate in a frontwall 78D and a rearwall 78C. The front andrear walls have appropriately sized slots 84A and 84B formed therein anddisposed in registration with each other to allow passage of a panel,FIG. 4B.

The illustrated loadlock 64 also includes a similarly formed stepped topand bottom surface. The loadlock 64 includes an outer top surface 64A,an inwardly stepped surface 64B, and a further inwardly stepped surface64C which forms the bottom of the process chamber 64D. The steppedsurfaces 64A, 64B, 64C are separated by wall portions 64E and 64F, whichare axially spaced apart and generally parallel to each other. Loadlock64 further includes parallel sidewalls 86A, 86B, and back and frontwalls 86C and 86D, respectively. The front wall 86D has a panel slot 88Aformed therein that is in registration with panel slot 88B formed inbackwall 86C. These panel slots are also sized to allow passage of apanel, as illustrated by arrow 87.

With further reference to FIG. 4A, the stepped top surface 74B ofloadlock 62 can have formed therein a peripheral seat or channel whichmounts an elastomeric member 90, e.g., an O-ring. The O-ring helps forma pressure tight seal along the periphery of the plate surface 74B, asis described in further detail below.

The floor portions 74C and 64C of loadlocks 62, 64 preferably include aselectively deployable workpiece support assembly, such as pin assembly96. The pin assembly includes two linear sets of pins 96A-96C and98A-98C. The illustrated pin assembly 96 is selectively deployable byappropriate control electronics between a deployed position where thepins outwardly extend from the bottom surface of the chamber, as shown,and a stowed position where the pins retract within appropriatepassageways. The pin assembly 96 can be actuated into the deployedposition to support a panel thereon. In this spaced position relative tothe bottom portion 64C, the pickup arm mounted within the processchamber 16 (and shown in FIG. 10) can easily access and remove the panelfrom the loadlock 64. According to another embodiment, the workpiecesupport assembly can employ a series of selectively deployable supportarms, such as those shown and described in Attorney Docket No. ETE-002,the teachings of which were previously incorporated by reference.

The bottom-most surface 64C further includes a vacuum port 94 preferablyformed in a central location thereon. The vacuum port can be coupled toa conventional pumping assembly to either pump down or vent the loadlockchamber, or to apply a vacuum pressure to the backside of the panel P.

The illustrated loadlocks 62, 64 can be stacked or assembled byvertically aligning loadlock 62 with the bottom loadlock 64 such thatthe outwardly stepped bottom portion 76A of loadlock 62 contacts theO-ring 90 mounted on the first inwardly stepped top portion 64B ofloadlock 64. Furthermore, the bottom outermost stepped surface 76Bcontacts the top surface 64A of loadlock 64. In this arrangement, thebottom most surface 76C of loadlock 62 forms the roof of the loadlockchamber 64D, FIG. 5, and the recessed top surface 64C of loadlock 64forms the floor of the chamber. As the loadlocks are stacked together,the bottom surface of the upper loadlock forms the roof of the chamberdisposed therebeneath. Those of ordinary skill will recognize that theloadlocks can have other geometric shapes that promote the stacking andnesting together of a plurality of loadlocks. For example, the loadlockscan be dove-tailed together or fashioned to have a tongue-in grooveconfiguration.

FIG. 4C depicts the loadlocks 62 and 64 of FIGS. 4A and 4B stacked andnested together. The elastomeric member 90 seats between the adjacentloadlocks to form a pressure seal therebetween. Furthermore, the matingrelationship of the loadlock surfaces further create a pressure sealalong these mating surfaces, for example, along surfaces 76A, 648 and76B, 64A and along the vertical walls of the loadlocks that extendbetween the horizontal sealing surfaces. Thus, the multiple matingsurfaces of the loadlocks 62, 64 when nested together form a secondaryor redundant pressure seal.

The telescopic engagement of loadlocks 62 and 64 form loadlock chamber64D. The chamber 64D preferably has a relatively small volume tofacilitate rapid pumping of the chamber 64D. This feature reducesprocessing time, which increases the throughput of the ion implantationsystem.

With reference to FIGS. 3A and 3B, multiple loadlocks 62-70 can bestacked together to form the stacked loadlock assembly 60. The totalnumber of nested loadlocks can be chosen to maximize the throughput ofthe ion implantation system 10. For example, the number of loadlocks canbe selected by one of ordinary skill to minimize processing time toprovide for a continuous and rapid cycling of panels. According to apreferred practice, a set of five stacked loadlocks forming fourloadlock chambers are employed. Those of ordinary skill will recognizethat other stacked arrangements utilizing varying numbers of loadlockscan be employed to facilitate rapid processing of panels.

The front faces of the loadlocks, for example, front face 78D ofloadlock 62 and front face 86D of loadlock 64, can havefastener-receiving apertures 102 formed therein at peripheral locations,as illustrated. The front portion 60A of the loadlock assembly isaffixed to front flange 72, which functions as the interface between theloadlock assembly 60 and the housing 14 of the process chamber 16, bysuitable fasteners, such as bolts 124A-124E, FIG. 5.

The illustrated flange 72 includes a rectangular outer portion 104having a front face 104A, back face 104B and peripheral side portions104C-104F. The front sealing face 104A has formed thereon threeconcentric grooves which seat elastomeric seals 108A-108C. The sealspreferably have a high wear resistance and can be formed of highmolecular weight polyethylene. The three successive concentric seals areprovided so that each individual seal is not exposed to a fullatmospheric to high-vacuum differential pressure. The grooves formed onthe front face 104A are preferably sized to accommodate slight movementof the seals within the grooves during the sliding movement of the frontsurface 104A with surface 34 of the process chamber housing 34.

Between-seal pumping can be employed to differentially pump between eachof the seals 108A-108C to lower the drop in pressure that must beachieved across any one particular seal. This between-seal pumping canbe provided by a conventional rotary vane, two-stage pumping systemwhich includes pressure ports that are formed between the seals 108A and108B, and between seals 108B and 108C. The pressure within the pressureport located between seals 108A and 108B can be pumped to about 1 Torr,and the pressure within the pressure port located between seals 108B and108C can be pumped to about 0.1 Torr.

With reference to FIGS. 3A, 3B and 5, the recess 106 of the flange 72terminates in a backwall 110 having formed therein a plurality ofvertically aligned slots 126A-126E that correspond to the slots formedin the stacked loadlock elements of the loadlock assembly 60. Thus, whenthe front flange 72 is secured to the loadlock assembly 60, the frontflange slots 126A-126E vertically and horizontally align with therespective slots of each of the loadlocks 62-70, FIG. 5. Each of theflange slots 126A-126E also have associated therewith a valve assembly128A-128E. For example, slot 126A of the front flange 72 has associatedtherewith valve assembly 128A. The valve 128A is selectively actuatableto seat over the slot 126A to seal the chamber 62D of loadlock 62.

Referring to FIGS. 1A and 5, the front surface 34 of the process chamberhousing 14 preferably has formed therein a panel aperture 114 whichcorresponds in dimensions to slots 126A-126E. The panel aperture 114 ispreferably in fluid communication with the process chamber 16 and thecavity 118 formed by the front flange recess 106. This cavity 118 can beevacuated to match the high vacuum pressure state of the process chamber16, or can be vented to match the lower vacuum pressure state of theloadlock chambers 62D-70D. This differential pumping relaxes the pumpingand venting requirements of each individual loadlock during paneltransfer, since each loadlock need not be pumped down to the high vacuumpressure of the process chamber.

The loadlock assembly 60 and the front flange 72 are preferably mountedon the linear bearing system and linear support system of FIG. 1A. Thebearings 28 are preferably coupled to the rear 104B of the flange 72.Additionally, the front surface 104A of the front flange is preferablyplaced in sliding sealing engagement with the chamber wall 34. Theillustrated linear bearing system preferably moves the loadlock assembly60 in the vertical direction, as indicated by arrow 120, to attain aselected vertical position. According to a preferred embodiment, acontrol system controls the vertical movement of the loadlock assemblysuch that the panel aperture 114 aligns with one of the apertures126A-126E of the front flange 72. During this vertical movement, theseals 108A-108C slidingly engage with the chamber wall 34. This slidingengagement permits the vertical movement of the loadlock assemblyrelative to the chamber wall 34 while maintaining a pressure sealtherebetween. To enhance the sliding engagement between the seals108A-108C and the chamber wall 34, the chamber wall can be lapped toreduce the frictional resistance to lateral motion of the loadlockassembly 60 and thus improve wear vacuum reliability.

In operation, the end effector 24, FIG. 1A, removes a panel P from oneof the cassettes 26 and inserts it through a slot of one of therespective loadlocks 62-70. The end effector 24 can thus load one ormore of the loadlocks with a panel. After loading the panels P into theloadlocks, valve assemblies associated with each slot are closed, andthe chambers 62D-70D are pumped down to the high vacuum pressure of theprocess chamber 16. In an alternate embodiment, the cavity 118 can bemaintained at an intermediate pressure between the pressures of theloadlock and the process chamber. In this circumstance, the loadlockchamber 62D-70D need only be pumped down to some intermediate pressurehigher than the vacuum condition of the process chamber 16.

The linear bearing system vertically positions the loadlock assembly 60at a selected vertical position. In this selected position, the panelaperture 114 formed in the sliding surface 34 of the process chamberhousing 14 aligns with one of the slots 126A-126E of the flange 72. Forexample, in the illustrated embodiment, panel aperture 114 aligns withslot 126B. Valve 128B is then opened and the pickup arm mounted withinthe process chamber retrieves the panel P from chamber 64D and places itinto the process chamber 16. As previously described, the pickup armthen imparts a vertical movement to the panel to move the panel from thehorizontal position P1 into the vertical position P2. The pickup arm isthen moved in the scanning direction and the panel is implanted by theion source. After processing, the pickup arm returns the processed panelto the loadlock 64. According to one practice, the processed panel,which has been heated during implantation by the energized ions of theion beam, is placed on the pin assembly 96 or other suitable supportstructure coupled to the loadlock 64. The pin assembly, which has beendisposed in the deployed position, allows the pickup arm to retrieve aswell as return the panel to the loadlock chamber 64D.

The linear bearing system then positions the assembly at a differentvertical position to allow the pickup arm to access another chamber,which has also been pumped down and its associated downstream valveopened, to continue the cycling of panels through the process chamber.As the second panel is being implanted, chamber 64D can further processthe implanted and heated panel. For example, the panel can beconvectively cooled by flowing a cooling fluid through the chamber viaone of the vacuum ports 92A-92E, and in this example, vacuum port 92B.Alternatively, the pin assembly 96 or other support assembly can bemoved from the deployed position into the stowed position to place thepanel into contact with the floor 64C of the chamber, FIG. 4A. Thechamber floor because of its size can form a heat exchanging surfacewhich conductively transfers heat from the panel. The loadlock floor 64Ccan be cooled by providing a supplemental cooling fluid thereto viaappropriate fluid conduits. For example, fluid conduits can be formedwithin the loadlock to circulate a cooling fluid therethrough, orcooling tubes containing a cooling medium can be mounted about theperipheral or outer portion of the loadlock. To enhance the uniformityof cooling of the panel, a vacuum pressure can be applied to thebackside of the panel through the vacuum port 94 (or other suitablevacuum network) formed in the floor 64C of the loadlock 64. This vacuumpressure forces the panel into cooling contact with the floor 64C of theloadlock, to attain substantially uniform conductive cooling thereof.During this conductive cooling process, the chamber 64D can be ventedclose to ambient pressure. The valve assembly at the upstream end canthen be opened to allow the end effector 24 to remove the paneltherefrom and place it within a storage cassette. Those of ordinaryskill will also recognize that a combination conductive/convectivecooling process can be employed.

During this panel cycling process, the loadlock assembly 60 ispositioned at different vertical heights to align the panel aperture 114with one of the loadlock slots. For example, the panel aperture 114 canbe aligned with slot 126A of the flange 72. The valve 128 opens and thepickup arm accesses the chamber 62D and removes the panel therefrom. Thepickup arm then moves the panel downstream in a scanning direction toprocess the panel. After the panel is implanted, the panel is returnedto the loadlock 62D. Similar to that described above, the valve 128A isclosed and the chamber is vented. The load bearing system then positionsthe loadlock assembly 60 at a different selected vertical position toallow the pickup arm to access another chamber. This system thus allowscontinuous cycling and processing of panels, which in turn significantlyincreases the throughput of the ion implantation system 10.

The illustrated ion implantation systems 10, 30 also allow theimplantation process to be divided into multiple implant stages, eachstage being separated by periods of cooling. The period of cooling canvary in order to allow the workpiece to be sufficiently cooled while itis located within a loadlock. High throughput in this ion implantationsystem can be maintained by processing workpieces in parallel. Inparticulars a workpiece 174 is constantly being processed within theprocess chamber 16 while other workpieces are being cooled within aparticular loadlock or loaded and unloaded from the loadlock. Theworkpiece can thus be held within a loadlock for an indefinite period oftime. After the holding period the workpiece can either be transferredback into the process chamber 16 for additional implantation, or theworkpiece can be removed from the loadlock through the upstream entryvalve.

The implantation system of the present invention provides for a numberof unique and beneficial advantages. One advantage is the highthroughput of the system which is provided for by the stacked loadlockassembly of the present invention. Another advantage is that theillustrated system allows multiple processing of panels by temporarilystoring panels within the loadlock chambers 62D-70D. Thus, for example,after a panel is implanted, it can be stored within a loadlock chamber,cooled, and later retrieved for further processing.

The system of the present invention further provides for multipleprocesses to be performed upon a single panel P. As illustrated in FIG.9, the housing 14" can be configured to form one or more partitions148A-148B along the process chamber. These partitions preferably dividethe process chamber 16" into contiguous and serial process sections144A, 144B and 144C which can be maintained at different pressures bysuitable pumping assemblies. The illustrated panel P, which is securedto pickup arm 152, moves in the scanning direction represented by arrow140 by the linear bearing and shaft assembly 154, 156. As the panel Pmoves in the scanning direction, it passes beneath the partitions148A-148B and through each particular processing section. For example,section 144A can preheat the panel as it passes therethrough, section144B can implant the panel, and section 144C can cool the panel. Thus,multiple processes can be performed upon the same panel nearlysimultaneously in the same process environment. This serial processingtechnique allows multiple processes to be performed upon the same panel,thus reducing the overall processing time and increasing the throughputof the implantation system.

FIG. 6 illustrates an alternate embodiment of the sliding sealarrangement of the present invention. In this illustrated embodiment, astrip of polyethylene sealing material 130 is affixed to the chamberwall 34' along its lateral face. This sealing material thus eliminatesthe need for providing the flange 72 which mounts to the loadlockassembly 60'. The front face of each loadlock further has mountedthereon a sealing material 132A-132F, such as a strip of high molecularweight polyethylene. Furthermore, the sliding surface 34' is formed asan extension of the process chamber 16' and of the housing 14'. Theillustrated loadlock assembly 60' is vertically movable as by the linearbearing system of the present invention, as denoted by arrow 134.

FIG. 7 shows a serial loadlock assembly formed of a plurality ofloadlocks 190A, 190B, and 190C. The serial assembly also includeselevator assemblies 192A, 192B, and 192C positioned for acting upon theloadlocks 190A, 190B, and 190C, respectively.

Each of the loadlocks 190A, 190B, and 190C include exit valves 194A,194B, and 194C for loading or unloading workpieces from an exit end ofthe loadlocks, respectively. The loadlocks 190A, 190B, and 190C canfurther include entry valves 195A, l95B, and 195C for loading orunloading workpieces from the entry end of the loadlocks, respectively.

Preferably, the loadlocks 190A and 190B are arranged so that a robot(not shown) can readily move a workpiece from loadlock 190A to loadlock190B. For instance, the loadlocks 190A and 190B can be oriented so thatthe exit valve 194A of loadlock 190A is adjacent the entry valve 195B ofloadlock 190B. A robot situated between the two loadlocks can then movea workpiece from loadlock 190A to loadlock 190B. Loadlock 190C isarranged with respect to loadlock 190B in an analogous fashion. Thisallows a serial chain of loadlocks, with robots spaced between theloadlocks, to be formed, as illustrated in FIG. 7. The serial chainprovides significant throughput increases when processing theworkpieces. In particular, different processes can be performed in thevarious loadlocks. This allows a plurality of workpieces to beundergoing various steps in the ion implantation sequence concurrently.For example, one loadlock may be loading or unloading workpieces from anexternal workpiece cassette, one loadlock may be cooling workpieces, andone loadlock may be loading or unloading workpieces from the processchamber 16.

According to a further aspect of the invention, each of the loadlocks190A, 190B, and 190C can also include an upper chamber 210 and a lowerchamber 212 divided by a separation plate 196. For example, loadlock190A includes a separation plate 196A dividing the loadlock into anupper chamber 210A and a lower chamber 212A, loadlock 190B includes aseparation plate 196B dividing the chamber into an upper chamber 210Band a lower chamber 212B, and loadlock 190C includes a separation plate196C dividing the loadlock into an upper chamber 210C and a lowerchamber 212C. Each chamber is sized to hold the workpiece 174, and thuseach loadlock is sized to hold more than one vertically spaced apartworkpiece. Accordingly, both the lower and upper chamber canconcurrently hold workpieces.

Preferably, the loadlocks are arranged in a serial chain as describedabove, with workpieces that move along a direction D1 in the serialchain being loaded and unloaded from the upper chambers in each of theloadlocks and with workpieces that move along a direction D2 in theserial chain being loaded and unloaded from the lower chambers in eachof the loadlocks. Accordingly, workpieces moving along direction D1 arefound only in the upper chambers 210 and workpieces moving alongdirection D2 are found only in the lower chambers 212. This embodimentprovides for a serial chain of loadlocks that does not requirecomplicated robot arms between each loadlock that are capable of movingvertically as well as horizontally.

Elevator assemblies 192A, 192B, and 192C are utilized to aide themovement of a workpiece through loadlocks 190A, 190B, and 190C,respectively. Each elevator assembly comprises an actuator 206 capableof movement along the direction of axis 214. The elevators aid in themovement of the workpieces by providing structure capable of allowing arobot arm to easily load and unload workpieces from within the loadlocks190.

In particular, the loadlocks 190 can further comprise a set of holes 200placed in the separation plate 196 and a set of holes 202 placed in thelower plate 198. Furthermore, the elevator assemblies 192 can furtherinclude a plate 208 mounted to actuator 206, and a set of pins 204mounted to the plate 208. The pins 204 are fixedly mounted to the plate208 such that they are aligned with an equal number of holes 200 and anequal number of holes 202. Preferably, in accordance with thisembodiment, actuator 206 is a three position actuator that places thepins 204 either above the level of separation plate 196, above the levelof lower plate 198, or below both of the plates 196 and 198.

Accordingly, when the elevator is properly aligned with a loadlock, theelevator aids in the loading and unloading of a workpiece from theparticular loadlock by lifting a workpiece off of or by lowering aworkpiece onto either the separation plate 196 or the lower plate 198.For example, as the elevator assembly 192A is activated the pins204A-204D move along direction 214. When the elevator 192A is properlyaligned with loadlock 190A and the elevator is raised, the pins204A-204D will first pass through holes 202A-202D and then through holes200A-200D. The movement of the pins through the holes provides a forcefor lifting and lowering a workpiece placed upon separation plate 196and upon lower plate 198.

In operation, a workpiece entering a lower chamber 212A of loadlock 190Afrom along direction D2 is first moved into the lower chamber 212A by arobot arm (not shown). Pins 204A-204D are inserted through holes202A-202D such that a workpiece placed within chamber 212A rests uponthe pins 204A-204D rather than upon the surface 198A. Once the workpieceis moved into the chamber 212A and placed upon the pins 204A-204D theelevator assembly 192A lowers the pins 204A-204D, thereby allowing theworkpiece to rest upon surface 198A. This advantageously allows aworkpiece to be inserted into a loadlock 190A and be cooled once it islowered upon the lower plate 198A. Cooling of the workpiece by theloadlock 190A can occur through processes described above, such asconvection cooling by direct contact of the workpiece with the lowerplate 212A.

When the plate is to be moved out of the loadlock along direction D2,the pins 204A-204D are inserted through the holes 202A-202D to raise theworkpiece above the level of surface 2198A. Once the workpiece is raisedabove the level of surface 198A a robot arm can be inserted into thechamber 212A to remove the workpiece.

An analogous process is used to insert and remove a workpiece fromchamber 210A. For example, a workpiece to be inserted into chamber 210Aalong direction D1 is moved into the chamber 210A by a robot arm. Pins204A-204D are inserted through holes 200A-200D to provide a support forthe workpiece. Once the workpiece has been positioned and is restingupon the pins 204A-204D the pins can be lowered through holes 200A-200Dto allow the workpiece to rest upon surface 196A. When the workpiece isto be removed from loadlock 190A the pins 204A-204D are once againinserted into holes 200A-200D thereby raising the workpiece above thesurface 196A. This allows a robot arm to be inserted into the chamber210A between the workpiece and the surface 196A, thereby allowing therobot arm to extract the workpiece from loadlock 190A.

FIG. 8 illustrates a pickup arm 216 that can be used to translate theworkpiece throughout the ion implantation system 10 or 30. Inparticular, the pickup arm 216 is preferably used to move the workpiecefrom the loadlock assembly 12 into the process chamber 16. In addition,the pickup arm 216 can be utilized to hold the workpiece and translatethe workpiece as it passes through the system.

The pickup arm is formed of a main body 218 having a raised edge onthree sides that forms a perimeter wall 220. Accordingly, the pickup arm216 contains a surface 222 that is recessed relative to the perimeterwall 220. The recessed surface 222 and the wall 220 are shaped toprovide a space for securing the workpiece.

The illustrated pickup arm 216 can include clamps 224A-224F for securinga workpiece to the pickup arm 216. The clamps 224A-224F each contain anupper flange 223 for applying a force to the workpiece that opposes theforce generated by the recessed surface 222. In particular, the upperflange 223 in conjunction with the recessed surface 222 pinches theworkpiece so as to secure it in place. The clamps 224 can move along thedirection of the first axis 230 to allow engagement and disengagementfrom the workpiece. In addition, the movement of the clamps along thefirst axis 230 allows for the clamps to secure a workpiece to the pickuparm 216 regardless of the size of the workpiece. One example of suchclamps are spring loaded clamps.

The illustrated clamps are also configured for movement along axis 232in order to vary the securing force applied by the clamps to theworkpiece. The securing force is advantageously varied in order togenerate a force sufficient to hold the workpiece in place, yet not sostrong as to damage the workpiece. In order to achieve the propersecuring force, either the upper flange 223 or the lower flange can bevaried along the direction of axis 232.

In order to overcome the difficulties in securing a workpiece that isslightly warped, i.e. varies from a horizontal plane, the clamps224A-224F can be varied independently. In those cases where theworkpiece tends to rise above the surface 222, the flanges 223 and 225can be raised in height relative to the surface 222 and apply a force toeither side of the workpiece thereby securing the workpiece.

With further reference to FIG. 8, the pickup arm 216 can include a firstchannel 234 and a second channel 236 that runs through the surface 222.The channel runs through the pickup arm from surface 222 to a bottomsurface 238 of the pickup arm 216. Accordingly, the pickup arm forms athree-pronged structure. The channels 234 and 236 provide access to thebottom of a workpiece resting upon surface 222.

In operation, the pickup arm 216 is inserted into a loadlock containinga workpiece. Typically the workpiece will be raised from the surface ofthe loadlock by the use of pins 204. As the pickup arm 216 is insertedinto the loadlock, the pickup arm 216 is aligned such that the pins 204pass along the channels 234 and 236. This allows the pickup arm to bepositioned below the workpiece which is simultaneously being supportedby the pins 204. In addition, at this point in time, the clamps 224 arefully retracted to allow the workpiece a higher degree of freedom ofmovement within the pickup arm 216.

Once the pickup arm is positioned, the pins 204 can be lowered therebyallowing the workpiece to come to rest on a recessed surface 222. Afterthe workpiece has come to rest on the surface 222 of the pickup arm theclamps 224 can be engaged. After the workpiece has been securely mountedto the pickup arm 216, the pickup arm is removed from the loadlock withthe workpiece.

The pickup arm detailed above has the further advantage of being able tohold the workpiece to the pickup arm while the pickup arm is rotatedabout a third axis 240. This allows the workpiece secured to the pickuparm to be positioned under an ion source 18.

FIGS. 10 through 13 illustrate another embodiment of the ionimplantation system of the present invention. The illustrated ionimplantation system 300 includes, from the input loading end of theimplantation system to the processing end (e.g., right to left in FIGS.10 and 11), a plurality of conventional panel cassettes 302 which storea number of flat panels. An end effector 306 is positioned so as toretrieve a panel from a selected cassette 302 and to place the panel inone of the loadlock chambers of the loadlock assembly 310. The endeffector 306 includes a pair of hinged arms 306A that are coupled to asupport bracket 306B that terminates in a panel support table 306C. Theend effector 306 is pivotable about a base 307 that translates alongaxis 311 to allow the end effector 306 to access and retrieve panelsstored in either cassette 302. The end effector arms 306A, 306A arehinged about fulcrum 306D, 306D and are extendible so as to move thesupport table 306C into and out of the panel cassettes. The end effectoris also pivotable about base 307 to allow the support table 306C toinsert or retrieve a panel from the loadlock assembly 310.

The end effector 306 is also vertically movable, as indicated in phantomin FIG. 1, to allow the effector to access panels along the entirevertical height of the panel cassettes 302, 302. The illustrated endeffector is known in the art, and need not be described further herein.

At the input end of the loadlock assembly 310 is formed an input gatevalve 312, which is selectively actuatable by a controller according toa user-defined sequence. An output gate valve 314 is formed at theopposite end of the loadlock assembly 310 and is in fluid communicationwith the loadlock assembly and with the process chamber 318 containedwithin the process housing 316. The illustrated process chamber 318mounts a single workpiece handling assembly 320, FIG. 12. Theillustrated workpiece handling assembly 320 performs a dual function ofloading and unloading panels from the loadlock assembly 310 and forsupporting the panel during processing. Specifically, the workpiecehandling assembly 320 supports the panel and translates the panel in ascanning direction past the ion source 330, which generates an ion beamof prescribed energy. When the workpiece handling assembly 320translates the panel through the ion beam, the panel is implanted by theenergetic ions contained within the beam.

The ion source 330 mounts to one side of the process housing 316, andpreferably to the side of the housing located opposite the wall mountingthe loadlock assembly 310. The illustrated ion implantation system 300further includes a gas box 332 which encloses a portion of the ionsource, including an RF matching circuit 330A. As is known in the art,the ion source 330 is surrounded by one or more high voltage bushings330B which function as an insulator for the high voltage source forpowering the ion source 330. A generator 334 is coupled at one end tothe gas box 332, and at another end to motor 336. The loadlock assembly310 and the process chamber 18 can be disposed at selected pressurelevels by the pump-down assembly 319, which includes pressure conduits319A and a pump source. The controller for controlling the operation ofthe system components can be housed in the facility box 321. Peripheralelectronics typically employed during use of the system 300 can behoused in various locations, including the electronics rack 323. Anyparticular exhaust generated during the implantation procedure can beexhausted from the enclosure 325 via exhaust conduits 327. Those ofordinary skill will recognize the function and operation of theconventional portions of the ion implantation system, which include theion source 330, gas box 332, generator 334 and motor 336, and need notbe described further herein.

FIGS. 12 and 13 illustrate the workpiece handling assembly 320 mountedwithin the process chamber 318 of the process housing 316. Theillustrated process housing 316 has formed along an outer surface anumber of structural webs 338 which provide rigid mechanical support forthe process housing, and thus help maintain the mechanical integrity ofthe system 300.

The ion source 330 is mounted to an outer wall 364 of the processhousing 316. The outer wall 364 preferably includes a firstsubstantially vertical wall portion 364A, which extends along axis 304,and a second canted upper wall portion 364B which mounts the ion source330. The illustrated surface 364B is preferably offset from the verticalaxis 304 by a selected amount, which is preferably equal to the offsetbetween the platen 348 of the workpiece handling assembly from the axis304 when disposed in its most vertical position, as described furtherbelow. By forming the canted surface 364B of the process housing 316 atan angle substantially equal to the angle between the platen and thevertical axis 304 during scanning, the system ensures that the platensurface will be substantially parallel to the ion source, and thusperpendicular to the ion beam 331 that is emitted from the ion source330. This creates a substantially uniform implant of the panel.

The process chamber 318 includes a first chamber portion 318A and asubstantially vertically extending chamber portion 318B. The chamberportion 318A is sized to accommodate removal of the panel P from one ofthe loadlock chambers of the loadlock assembly 310. The other verticallyextending chamber portion is preferably smaller and is sized toaccommodate transverse scanning of the panel in the scanning direction360, while concomitantly reducing the total chamber volume to relax thepumping constraints of the process chamber, e.g., allow fasterevacuation of the chamber. The chamber portion 318B also extends farenough in a direction transverse, or even orthogonal, to axis 305 toallow the panel to pass completely by the ion beam 331.

The loadlock assembly 310 is mounted to another wall 365 of the processhousing 316, preferably opposite the wall 364 mounting the ion source330. The illustrated loadlock assembly 310 is fixedly mounted to thehousing wall 365 and overlies a series of vertically aligned slots390A-390D that are in registration with the openings of the loadlockassembly 310. These openings preferably open onto the loadlock chambersof each loadlock in the loadlock assembly 310. The loadlock assembly ispreferably similar to the stackable and nestable loadlock assembly 60 ofFIGS. 1A-6.

The illustrated loadlock assembly preferably includes output gate valves314 that selectively close each one of the openings of the loadlockchamber. The operation of the output gate valves is known in the art.The loadlock assembly 310 is also sealingly coupled to the wall 365 ofthe housing 316 to maintain a relatively pressure-tight and fluid-tightseal.

With further reference to FIG. 12, the illustrated workpiece handlingassembly 320 includes a number of pivotable components which effectuatethe loading and unloading of the panel from the loadlock assembly 310,as well as to tilt or orient the panel in a substantially verticalorientation to translate the panel therealong during processing. Theworkpiece handling assembly 320 includes a vertical carriage 322 that isoperatively coupled to a vertically extending guide rail 324, e.g.,extends along axis 304. The illustrated guide rail 324 includes a groovewhich seats the vertical carriage 322. The vertical carriage and guiderail are preferably coupled to a driving mechanism, such as a lineardrive motor or lead screw, which selectively and variably moves thecarriage along the guide rail 324 along axis 304. A support arm 326 ispivotally attached to the vertical carriage 322 at a pivot point 327.Also attached to this pivot point is a pair of altitude control arms328A and 328B. The altitude control arms are each coupled to an altitudecontrol link 340A and 340B, respectively. As shown, a first end of thecontrol link 340A is coupled to one end of the control arm 328A, theopposite end of which is coupled to the pivot point 327. The oppositeend of the control link 340A is pivotally coupled to pivot point 342 andto an intermediate support arm 344. The intermediate support arm 344terminates at an end opposite the pivot point 342 at a pivot point whichhas attached thereto the platen 348. The platen includes a first face348A and a second recessed face 348B to form a lip 348C therebetween.The lip is sized to mate with one end of a panel P, and serves to holdor support the panel on the platen 348 during processing, as describedfurther below.

The illustrated altitude control links 340a, 340b are each operativelycoupled to a drive mechanism, such as a linear motor, drive screw orother types of driving structures. The drive mechanisms in conjunctionwith the components of the workpiece handling assembly 320 providestructure for removing a panel P from one of the loadlock constituentsof the loadlock assembly 310, and to translate the panel in a scanningdirection designated by arrow 360 past the ion source 330.

In operation, the end effector 306 removes a panel from one of the panelcassettes 302. A controller then opens the upstream (input) gate valve312 to allow the end effector 306 to place the panel P within one of theloadlocks of the loadlock assembly 310. The end effector, according to auser-defined sequence, further loads panels or removes panels from aparticular loadlock. This user-defined sequence allows the ionimplantation system 300 to process multiple workpieces concurrently toeffectuate a high throughput ion implantation system. For simplicity,the loading and implantation of a single panel will be described furtherbelow, but those of ordinary skill will readily recognize thatadditional panels can be loaded in the loadlock during the implantationstep, or other panels can reside in one of the remaining loadlocks whereit undergoes further processing, such as cooling.

Once a panel P has been loaded in a selected loadlock, the workpiecehandling assembly 320 removes the panel P and holds the panel duringimplantation. According to one sequence, the vertical carriage 322 ismoved from position A vertically upward along guardrail 324 to a secondvertical position B. When the handling assembly is disposed at positionB, the altitude control link 340A pivots about pivot point 342 to movethe platen 348 into a loadlock chamber, such as chamber 354. The panelresiding within the chamber 354 is preferably vertically spaced from thefloor of the chamber to allow the platen 348 to slide beneath the panelto remove it from the chamber 354. When the platen 348 is slid beneaththe panel P, the end of the panel closest the process chamber 318contacts the lip 348C of the platen.

The panel P is removed from the chamber of the loadlock 354 by actuatingthe control link 340A to pivot about the pivot point 342, whileconcomitantly actuating the vertical carriage 322 to move verticallydownward along the guiderail 324 to a position the same as or close toposition A. The altitude control arms and links 328A, 328B, 348, 340Bare then operatively controlled to move about pivot points 327 and 342to swing the platen in a direction illustrated by arrow 358 to tilt theworkpiece relative to the horizontal plane of the implantation system300. According to a preferred embodiment, the workpiece handlingassembly tilts the platen surface 348A relative to the axis 304 to forman angle therebetween that is greater than zero degrees, and ispreferably greater than 5 degrees. According to a most preferredembodiment, the platen surface and the axis 304 form an angle of about 5degrees. This specific orientation allows gravity to hold the panel onthe platen.

The vertical carriage 322 is then moved vertically upward to position C,and the illustrated pivotable components of the workpiece handlingassembly 320 are adjusted to translate the platen surface in thescanning direction denoted by arrow 360. During this scanning motion,the vertical carriage 322 and the pivoting components of the workpiecehandling assembly maintain the same degree of separation between theplaten surface and the chamber wall 364B. That is, the scanningdirection 360 is substantially parallel to the wall 364B. This constantseparation between the panel and wall 364B during processing ensures auniform implant of the workpiece. The workpiece handling assembly thenreverses the motion of the panel to place the implanted workpiece intoone of the loadlock chambers.

During the implantation process, a portion of the ribbon beam 19 spillsover the edge of the panel P. A beam monitoring apparatus 398 can behoused within the chamber 318, or can be coupled to the process housing316 and communicate with the chamber 316, to analyze the ion beam 19,331. The monitoring apparatus further enables the ion implantationsystem of the invention to achieve increased throughput by measuring theparameters of the ion beam 331 while contemporaneouslytreating/implanting the workpiece with the ion beam. The term parametersrefers to those characteristics of the ion beam relevant to theimplantation of ions in a workpiece, such as the current density of theion beam, the number of neutral particles in the ion beam, and the massof particles in the ion beam. In comparison to prior art techniques thatintermittently measured the current density of the ion beam between theimplantation of a predetermined number of workpieces, the beammonitoring apparatus takes measurements of the ion beam during theimplantation of the workpiece. Accordingly, the ion beam can beconstantly monitored during the implantation process withoutinterrupting the implantation process to obtain ion beam measurements.

The illustrated ribbon beam 19 that extends along an axis of elongationand has a width that extends along a second path transverse to theelongation axis. The ribbon beam can be formed from an elongated slot ina plasma electrode of the ion source having a high aspect ratio, that isa ribbon beam having a length that exceeds the width by fifty (50) timesor more. Ribbon beams prove effective in implanting large areaworkpieces because they can reduce the number of passes of the workpiecethrough the ion beam required to obtain a preselected dosage. Forexample, prior art techniques required that the ion beam be scanned intwo orthogonal directions over the workpiece to completely cover theworkpiece. In comparison, when a ribbon beam has a length that exceedsat least one dimension of the workpiece, only one scan of the workpiecethrough the ribbon beam is required to completely cover the workpiece.

Ribbon beams formed from electrode slots having even higher aspectratios of 100:1 prove useful in implanting larger workpieces, such asworkpieces having dimensions of 550 mm by 650 mm and larger. Theseribbon beams, however, are more difficult to control and to keepuniform. Accordingly, continuous measurement and control of theparameters of the ion beam prove to be particularly important when usingribbon beams formed from electrode slots having high aspect ratios. Thepreferred ion beam monitoring apparatus is set forth in Attorney DocketNo. ETE-003, the teachings of which were previously incorporated byreference.

The multiple processing of panels by the ion implantation system 300 isschematically illustrated in FIG. 13. The panel P removed from theloadlock 372 is moved in the direction indicated by arrow 374. Uponremoval of the panel P from the loadlock 372, the workpiece handlingassembly 320 tilts the platen surface, and thus the panel, in adirection transverse to the substantially horizontal direction fromwhich the panel P is removed from the loadlock. Specifically, the panelP is disposed in a first transverse position 378 and is then movedvertically downward along axis 304 and disposed in a further verticalposition 380, as indicated by arrow 381. The workpiece handling assembly320 then moves the panel upwardly in the translation direction, asindicated by arrows 382 and 384.

While the illustrated panel is being implanted, another panel P2 isloaded in an adjacent loadlock, where either it awaits processing, or iscooled via the cooling system of the ion implantation system, such asthe cooling system associated with the loadlock assembly of FIGS. 1A-6.Additionally, a further panel P3 can be loaded into another loadlock ofthe loadlock assembly 310.

The ion implantation system 300 of the present invention has a number ofbeneficial advantages. One advantage of the present ion implantationsystem is that it employs a single workpiece handling assembly to bothload an implanted panel into and remove a panel from the loadlockassembly 310, while concomitantly supporting the panel duringtranslation along the scanning direction. The use of a single workpiecehandling assembly to both manipulate a panel and to support it duringimplantation reduces the number of mechanical units which must bemounted within the process chamber, as well as reduces the number ofmechanical transfers of the panel during processing relative to priorart ion implantation systems. For example, prior art systems employed afirst robotic arm to remove a panel from a loadlock and to load thepanel on a separate translating stage. The translating stage then movesthe panel in the scanning direction where it is implanted by the ionsource. By integrating these components into a single workpiece handlingassembly, the number of workpiece transfers is reduced, thus increasingthe throughput of the implantation system.

Another advantage of the present invention is that the workpiecehandling assembly 320 translates the panel in a vertical scanningdirection, where it is implanted by the ion source 330. Constructing theprocess housing such that it accommodates movement of the panel in avertical scanning direction, reduces the overall size and footprint ofthe housing. This results in a reduced overall footprint for the ionimplantation system 300. For example, the process housing has ahorizontal footprint of less than about 60 inches along axis 304, andhas a vertical height of about 102 inches. The dimensions of thecomplete ion implantation system illustrated in FIGS. 10 and 11 isapproximately 197 inches long and 92 inches wide. Those of ordinaryschool will recognize that incorporating the end effector and panelcassettes will add to the overall dimensions of the ion implantationsystem, and according to a preferred embodiment, these dimensions areabout 290 inches long and about 89 inches wide.

The concurrent processing of multiple panels is further illustrated bythe control sequence timing diagram of FIG. 14. The timing diagramgraphically illustrates the events that occur for various loadlocks ofthe loadlock assembly 310 during the processing of multiple panels. Thecontrol sequence table 388 illustrates the particular sequences thatoccur within the loadlocks of the loadlock assembly 310, designated asloadlock 1, loadlock 2, loadlock 3, and loadlock 4. The sequence numbers1-4 correspond to particular operational events which occur during thetiming sequence illustrated by the timing diagram 390. For example,block 1 corresponds to the operational events that occur between about 0and 30 seconds, block 2 corresponds to the operational events that occurbetween about 30 and 60 seconds, block 3 corresponds to the operationalevents that occur between about 60 and 90 seconds, and block 4corresponds to the operational events that occur between about 90 and120 seconds. The operational events that occur during blocks 1-4 arelisted under the event heading at the left-most portion of the timingdiagram 390. One example of an event timing sequence is as follows. Attime 0, the following events occur the front gate valve VF, which istypically adjacent the end effector of the ion implantation system, isopened by any suitable controller, such as a general purpose computer.After the gate valve VF is opened, a panel is loaded therein by the endeffector 306. Once the panel is loaded within the loadlock chamber, thevalve VF is closed and the chamber is pumped down by any suitablepumping assembly. As illustrated, the pump down of the loadlock takesabout 25.5 seconds to complete.

Upon completion of the pump down of the loadlock, the downstream gatevalve VR is opened and the workpiece handling assembly 320 removes thepanel from the loadlock and translates it in the scanning direction tobe implanted by the ion source. The implant portion of this timingsequence takes about 12 seconds to complete. The workpiece handlingassembly is then positioned to unload the panel within the loadlockchamber. The gate valve VR is then closed and the loadlock chamber isthen vented up to an appropriate pressure, such as atmospheric or anyintermediate pressure. Furthermore, during the venting portion of thetiming sequence, the heated panel is cooled according to the techniquesdescribed herein. As part of the vent/cool timing sequence which spansbetween blocks 3 and 4 of the timing sequence, and which takesapproximately 49.5 seconds, the workpiece-support assembly mountedwithin the loadlock chamber is vertically moved between its deployedposition where an implanted panel can be loaded thereon, and the stowedposition where the implanted panel can be placed in intimate facingcontact with the relatively cool floor of the loadlock.

The control sequence table 388 thus illustrates that different stages ofthe timing sequence occur at different loadlocks. The events that occurfor a particular panel associated with a particular loadlock can thus bemanipulated to facilitate the concurrent processing of multiple panels.According to a preferred practice, approximately 80 panels per hour canbe processed by the ion implantation system 300 of the presentinvention.

It will thus be seen that the invention efficiently attains the objectsset forth above, among those made apparent from the precedingdescription. Since certain changes may be made in the aboveconstructions without departing from the scope of the invention, it isintended that all matter contained in the above description or shown inthe accompanying drawings be interpreted as illustrative and not in alimiting sense.

It is also to be understood that the following claims are to cover allgeneric and specific features of the invention described herein, and allstatements of the scope of the invention which, as a matter of language,might be said to fall therebetween.

Having described the invention, what is claimed as new and desired to besecured by Letters Patent is:
 1. A method for implanting a workpiecewith an ion source, comprising the steps of:providing a processingchamber, providing a loadlock assembly having at least one loadlockchamber separate from and located outside of said processing chamber,moving only said loadlock assembly into substantially pressure-tightcommunication with said processing chamber, moving the workpiece fromthe loadlock chamber into the separate processing chamber, while in theprocessing chamber, implanting the workpiece with the ion source, andremoving the workpiece from the processing chamber into the loadlockchamber.
 2. The method of claim 1, further comprising the step ofcooling the workpiece when resident within the loadlock chamber.
 3. Themethod of claim 1, further comprising the step of repeating the steps ofmoving the workpiece and implanting the workpiece until the entireworkpiece is implanted.
 4. The method of claim 1, further comprising thestep of applying a pressure to one side of the workpiece with a vacuumnetwork when resident within the loadlock chamber to effect coolingthereof.
 5. The method of claim 1, further comprising the step ofdrawing the workpiece into relatively close proximity with a coolingsurface of the loadlock chamber to effect heat transfer between theworkpiece and the cooling surface.
 6. The method of claim 5, furthercomprising the step of circulating a cooling fluid through the coolingsurface.
 7. The method of claim 1, further comprising the step ofcontrolling the pressure within the loadlock chamber so as to define agap between the workpiece and a cooling surface of the loadlock toensure that the heat transfer between the cooling surface and theworkpiece is predominantly conductive.
 8. The method of claim 1, furthercomprising the step of disposing the loadlock chamber at a selectedpressure to create a force on the workpiece to place the workpiece inclose proximity to a cooling surface within the loadlock chamber.
 9. Themethod of claim 1, further comprising the steps ofpositioning theworkpiece within the loadlock chamber and relative to a cooling surfaceof the loadlock chamber to form a gap between the workpiece and thecooling surface, and disposing the loadlock chamber at a pressurebetween about 35 Torr and about 760 Torr, such that the gap beneath theworkpiece is disposed at a pressure between about 20 Torr and about 745Torr, thereby forming a net force on the workpiece that draws theworkpiece toward the cooling surface.
 10. The method of claim 1, furthercomprising the step of allowing passage of a mechanical lift assemblyinto the loadlock chamber to act upon the workpiece.
 11. The method ofclaim 1, further comprising the step of placing the workpiece back intothe processing chamber from the loadlock chamber for furtherimplantation.
 12. A method for implanting a workpiece with an ionsource, comprising the steps of:providing a processing chamber,providing a loadlock assembly having at least one loadlock chamberseparate from and located outside of said processing chamber, movingonly said loadlock assembly into substantially pressure-tightcommunication with said processing chamber, placing the workpiece into aloadlock chamber, moving the workpiece between the loadlock chamber andthe separate processing chamber, implanting the workpiece when disposedin the processing chamber, and removing the workpiece from theprocessing chamber for placement within one of said at least oneloadlock chamber.
 13. The method of claim 12, further comprising thestep of cooling the workpiece when resident within the loadlock chamber.14. The method of claim 12, further comprising the step of applying apressure to one side of the workpiece with a vacuum network whenresident within the loadlock chamber to effect cooling thereof.
 15. Themethod of claim 12, further comprising the step of controlling thepressure within the loadlock chamber so as to define a gap between theworkpiece and the cooling surface to ensure that the heat transferbetween the cooling surface and the workpiece is predominantlyconductive.
 16. The method of claim 12, further comprising the stepsofpositioning the workpiece within the loadlock chamber and relative toa cooling surface of the loadlock chamber to form a gap between theworkpiece and the cooling surface, and disposing the loadlock chamber ata pressure between about 35 Torr and about 760 Torr, such that the gapbeneath the workpiece is disposed at a pressure between about 20 Torrand about 745 Torr, thereby forming a net force on the workpiece thatdraws the workpiece toward the cooling surface.
 17. The method of claim12, further comprising the steps ofpositioning the workpiece within theloadlock chamber, and forming a net force on the workpiece that drawsthe workpiece toward a cooling surface of the loadlock chamber to coolthe workpiece.
 18. The method of claim 12, further comprising the stepof repeating the transfer of the same workpiece between one of theloadlock chambers and the process chamber a selected number ofadditional times to further implant the workpiece.
 19. A method forimplanting a plurality of workpieces with an ion source, comprising thesteps of:providing a processing chamber, providing a loadlock assembly,having a plurality of loadlock chambers separate from and locatedoutside of said processing chamber, moving only said loadlock assemblyinto substantially pressure-tight communication with said processingchamber, bringing a selected one of said plurality of loadlock chambersinto fluid communication with the separate processing chamber, whereineach of said plurality of loadlock chambers is sized for containing atleast one workpiece, transferring one of the plurality of workpiecesfrom the selected loadlock chamber to the processing chamber, implantingthe workpiece with an ion beam, transferring the workpiece back to theselected loadlock chamber, and repeating the above steps until at leastone workpiece has been implanted more than one time.
 20. A method forimplanting a plurality of workpieces with an ion source according toclaim 19, comprising the further step of:disposing the selected loadlock chamber at a selected pressure prior to bringing the selectedloadlock chamber into fluid communication with the processing chamber.21. A method for implanting a plurality of workpieces with an ion sourceaccording to claim 19, comprising the further step of:equalizing thepressure between the selected loadlock chamber and the processingchamber prior to bringing the selected loadlock chamber into fluidcommunication with the processing chamber.
 22. A method for implanting aplurality of workpieces with an ion source according to claim 19,comprising the further step of:cooling the workpiece inside of theselected loadlock chamber subsequent to transferring the workpiece backto the selected loadlock chamber.
 23. A method for implanting aplurality of workpieces with an ion source according to claim 19,comprising the further step of:suspending the workpiece inside of theselected loadlock chamber subsequent to transferring the workpiece backto the selected loadlock chamber to effect cooling of the workpiece byconvection.
 24. A method for implanting a plurality of workpieces withan ion source according to claim 19, comprising the further stepsof:disposing a surface inside of the selected loadlock chamber at aselected temperature, and bringing the workpiece into contact with thesurface subsequent to transferring the workpiece back to the selectedloadlock chamber to effect cooling of the workpiece by conduction.
 25. Amethod for implanting a plurality of workpieces with an ion sourceaccording to claim 24, comprising the further step of:circulating acooling fluid through the surface to dispose the surface at the selectedtemperature.
 26. A method for implanting a plurality of workpieces withan ion source according to claim 19, comprising the further stepsof:coupling a vacuum network to a surface inside of the selectedloadlock chamber, and employing the vacuum network to draw the workpieceinto contact with the surface subsequent to transferring the workpieceback to the selected loadlock chamber to effect cooling of the workpieceby conduction.
 27. A method for implanting a plurality of workpieceswith an ion source according to claim 19, comprising the further stepof:monitoring implantation parameters of the ion sourcecontemporaneously with implanting the workpiece.
 28. A method forimplanting a plurality of workpieces with an ion source according toclaim 27, wherein the monitoring step includes monitoring at least oneof:current density of the ion source, number of neutral particles in theion source, and mass of particles in the ion source.
 29. A method formulti-processing a workpiece, comprising the steps of:moving a workpiecefrom a loadlock chamber into a separate processing chamber, treating aworkpiece in the processing chamber, moving the workpiece from theprocessing chamber into the loadlock chamber, positioning the workpiecewithin the loadlock chamber and relative to a cooling surface of theloadlock chamber to form a gap between the workpiece and the coolingsurface, disposing the loadlock chamber at a pressure between about 35Torr and about 760 Torr, such that the gap beneath the workpiece isdisposed at a pressure between about 20 Torr and about 745 Torr, therebyforming a net force on the workpiece when within the loadlock chamberthat draws the workpiece toward the cooling surface, and placing theworkpiece back into the processing chamber for further processing.
 30. Amethod for multi-processing a workpiece with an ion source, comprisingthe steps of:placing a the workpiece into a loadlock chamber, moving theworkpiece between the loadlock chamber and a separate processingchamber, treating the workpiece when disposed in the processing chamber,removing the workpiece from the processing chamber for subsequentplacement within the loadlock chamber, positioning the workpiece withinthe loadlock chamber and relative to a cooling surface of the loadlockchamber to form a gap between the workpiece and the cooling surface,disposing the loadlock chamber at a pressure between about 35 Torr andabout 760 Torr, such that the gap beneath the workpiece is disposed at apressure between about 20 Torr and about 745 Torr, thereby forming a netforce on the workpiece that draws the workpiece toward the coolingsurface, and repeating the transfer of the workpiece between theloadlock chamber and the process chamber a selected number of additionaltimes to completely treat the workpiece.